New Product Introduction

Nexperia MLPAK33 MOSFETs

MLPAK33 MOSFETs - Surface mount package with thermal enhancement

Nexperia MOSFET in MLPAK33 package - front and back side illustration

MLPAK33 MOSFETs for mobile, computing, consumer and industrial applications, available in N-Channel and P-Channel. The package comes with a large heat sink area for high thermal power capability, housed in the 3.3 x 3.3 mm footprint (0.8 mm height). Offering footprint compatibility for the industry-known DFN3333. MLPAK33 brings low spiking, low ringing, low QG, low QGD and low RDS(on) for benefits in load switching applications such as smartphones.

 

Key features

  • Large heat sink for high thermal power capability 
  • Small 3.3 x 3.3 mm footprint
  • Low height of only 0.8 mm
  • Optimized for a consumer grade application profile
  • Low spiking and ringing for low EMI designs
  • Voltage range VDS 25-30V
  • Low QG & QGD for super-fast switching
  • Low RDS(on) down to 6 mΩ and ID up to 13 A
  • Logic-level compatible drive voltage
  • Power dissipation (Ptot) of up to 4.8 W

 

Applications

  • Low RDS(on) load switching for e.g. smartphones
  • DC/DC conversion
  • Battery management
  • Charging devices
  • Solid state / hard drive

 

Product portfolio

  Product Datasheet
25V 30V 60V
4 - 8 mΩ   PXN4R7-30QL   Download datasheet
  PXN5R4-30QL   Download datasheet
PXN6R2-25QL     Download datasheet
  PXN6R7-30QL   Download datasheet
PXN7R7-25QL     Download datasheet
8 - 12 mΩ   PXN8R3-30QL   Download datasheet
  PXN9R0-30QL   Download datasheet
  PXN010-30QL   Download datasheet
    PXN012-60QL Download datasheet
12 - 16 mΩ   PXN017-30QL   Download datasheet
  PXN018-30QL   Download datasheet

 

Links & Documents



Nexperia

Mid-Low Power MOSFETs

Latest innovations in silicon and packaging for low and mid voltage MOSFETs targeting automotive and industrial applications

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