Nexperia

Powering the Future of SiC with Advanced Top-Side Cooling

SiC brings undeniable advantages in switching speed, efficiency, and voltage handling, but material capability alone does not guarantee system performance. What ultimately matters is how the device is fabricated and assembled. Packaging, cooling, and integration turn SiC’s promise into measurable gains. Nexperia’s top-side cooled X.PAK devices illustrate this point: by refining thermal paths, minimising parasitics, and ensuring mechanical strength, they show that design discipline at the package level can unlock performance beyond traditional TO-263-7 devices.

For engineers, the challenge is to carry that same thinking into the system. Interface quality, mounting pressure, and overall assembly can define how much power a SiC device truly delivers in the field. A strong device still needs a strong thermal connection to its environment to sustain performance under real operating conditions.

While semiconductor material innovation creates the potential, packaging and integration turn it into performance. Recognising and optimising across these layers, from manufacturers such as Nexperia designing SiC semiconductors to engineers integrating the device, enables the creation of compact, efficient, and durable power systems that meet the growing demands of electric mobility and industrial automation.