Octavo Systems delivers innovative high quality System-in-Package (SiP) solutions that can be used as common building blocks in your electronic design. The company focuses on creating products based on standardised systems that can be used in a wide variety of different applications, to simplify your design and speed up your time to market.
By creating SiP devices, Octavo allows the idea behind Moore’s law to continue, as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through its technology and design innovations, Octavo is making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products.
New product introductions
| Image | Product | New |
|---|---|---|
 | Octavo OSDZU3-REF The OSDZU3-REF if a powerful development and evaluation platform for the OSDZU3 System in Package. Based on the UltraZed PCIe Carrier Card from Avnet, the OSDZU3-REF is a 4 layer design that features some common peripherals, such as USB 3.0, SATA, an | |
 | Octavo OSDZU3 System-in-Package The OSDZU3 is the fastest and most flexible way to develop a system around the Xilinx Zynq UltraScale+ MPSoC. It allows you to harness the performance of the ZU3 MPSoC, while removing the complexities without sacrificing flexibility. The OSZU3 integ | |
 | Octavo OSD32MP15x System-in-Package The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1. Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same s | |
 | Octavo OSD335x-SM System-in-Package The OSD335x-SM is the smallest Texas Instruments AM335x module. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, all the needed passives, and 4KB of EEPROM into a single BGA package. At 21mm X |
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