AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. AMD produces microprocessors and support circuitry for communications and networking applications. Solutions include Opteron, Athlon, Sempron, ASB1 & Geode processors and chipsets. ATI Radeon Embedded Graphics processors for 3D Graphics and multimedia.
AMD (formerly Xilinx) is now also the leading provider of All-Programmable FPGAs, SoCs (such as Zynq 7000), MPSoCs, and 3D ICs. AMD uniquely enables applications that are both software-defined and hardware-optimised – powering industry advancements in Cloud Computing, Embedded Vision, Industrial IoT, and 5G.
Bringing Adaptive Platforms to Robotics and the Intelligent Factory
Demand for robotics is increasing rapidly. Designers and engineers must create robots that integrate machine learning and artificial intelligence while still being safe and secure operating alongside humans. AMD has the answer with their scalable and out-of-the-box development platform for robotics, the Kria™ SOM KR260 Robotics Kit. These platforms have the features and tools to accelerate your development and enable rapid development of robotics and machine vision products without the need for FPGA experience.
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AMD
5G Solutions
The RFSoC family includes state-of-the-art solutions that eliminate the need for discrete converters, placing everything you need on a single chip, and features highly optimized synchronization for phased array applications.
AMD
RFSoC & mmWave
Avnet Silica and its partners create and provide hardware and the technology for RFSoC, with various development platforms and interconnect solutions available.
AMD
Aerospace & defence portfolio
AMD serves the aerospace and defence industry with commercial, defence, and space grade system-level solutions that span industry-leading FPGA, SoC and ACAP devices, advanced IP solutions, and the next generation of design tools.
AMD
SoC Portfolio
AMD’s SoC portfolio integrates the software programmability of a processor with the hardware programmability of an FPGA, providing you with unrivaled levels of system performance, flexibility, and scalability.
AMD & Avnet Silica
Automotive Solutions
Electrification, infotainment and advanced driver-assistance systems (ADAS) are changing our conception of what automobiles can be. Avnet Silica helps to simplify the technological complexity.
AMD
Zynq® UltraScale+™ RFSoCs
Zynq® UltraScale+™ RFSoCs integrate multi-giga-sample RF data converters and soft-decision forward error correction (SD-FEC) into a SoC architecture.
AMD | onsemi | Avnet Silica
Machine Vision solutions
Choosing the right technology partners like Avnet Silica, AMD and onsemi for your next machine vision innovation optimizes efficiency, mitigates potential risks and maximizes profit potential.
AMD
FPGA Solutions
Learn more about AMD’s Artix®, Kintex®, & Virtex® FPGA solutions and download the Zynq®-7000 All Programmable SoC Overview document.
- TRIA SM2S-RYZ2
- TRIA SM2S-ZUSP
- TRIA SM2S-RYZ
Module is the smallest embedded platform for the AMD Ryzen Embedded R2000 processor family
The TRIA SM2S-RYZ2 module is the smallest embedded platform for the AMD Ryzen Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained space, power and cooling. The configurable Thermal Design Power (TDP) ranges from low 12 W to 15 W. The integrated Radeon™ Graphics with up to 8 Compute Units stands for highest graphics performance.
Module is based on Xilinx Zynq UltraScale+ MPSoC and supports ZU2, ZU3, ZU4 or ZU5 FPGA complexity
The TRIA SM2S-ZUSP module is based on Xilinx Zynq UltraScale+ MPSoC and supports ZU2, ZU3, ZU4 or ZU5 FPGA complexity. Zynq UltraScale+ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Integrating an ARM®-based system for advanced analytics and on-chip programmable logic for task acceleration creates unlimited possibilities for applications including 5G Wireless, next generation ADAS, Internet-of-Things, Industrial Automation, Medical, Transportation and Robotics.
Module is the smallest embedded platform for the AMD Ryzen Embedded Low Power V1000/R1000 processor family
The TRIA SM2S-RYZ module is the smallest embedded platform for the AMD Ryzen Embedded Low Power V1000/R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained space, power and cooling. The configurable Thermal Design Power (TDP) ranges from low 6 W to 15 W. The integrated “Vega” graphics processor unit with three up to 1.200 MHz fast compute units stands for highest graphics performance.
- TRIA C6C-RYZ8
- TRIA C6C-RYZ
Ideal for applications like medical imaging, gaming platforms, AI enhanced solutions in the edge and security appliances
The COM Express Type 6 module TRIA C6C-RYZ8 is ideal for applications like medical imaging, gaming platforms, AI enhanced solutions in the edge and security appliances. With the on-chip XDNA Neural Processing Unit, it is the right fit for enabling AI applications, that run on the local system independently from a cloud-based approach. Applications also gain outstanding compute performance from up to eight CPU cores and six RDNA3 work group processors integrated into the AMD RyzenTM Embedded 8000 Series Processor.
Module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family
The TRIA C6C-RYZ module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The TRIA C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1.
