Nexperia Industrial & Automotive LFPAK56D half-bridge MOSFETs
LFPAK56D half-bridge - 60% lower parasitic inductance and improved thermal performance
A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. Occupying 30% lower PCB area compared to dual MOSFETs for 3 phase motor control topologies due to the removal of PCB tracks whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes, with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability.
Key features
- 60% lower parasitic inductance due to internal clip connection
- 30% space saving on PCB compared to LFPAK56D dual
- High performance ID max >60 A
- Low thermal resistance
- Flexible leads for BLR
- Footprint compatible with LFPAK56D dual
- External leads for easy AOI
- Beyond AEC-Q101 for automotive products
Applications
Industrial
- Handheld power tools, portable appliance and space constrained applications
- Brushless or brushed DC motor drive
- DC-to-DC systems
- LED lighting
Automotive
- 3-phase automotive power train applications
- Fuel, oil and water pumps
- Motor control
- DC/DC
Product portfolio
Industrial
Automotive
silica content library/npi/nexperia/lfpak56d-half-bridge-mosfets
Nexperia LFPAK56D half-bridge MOSFETs | Avnet Silica
