Renesas RA6E1 MCU Group
RA6E1 microcontrollers - 200MHz Arm® Cortex®-M33, the first entry-line product of the RA6 series
The Renesas RA6E1 is based on a 200 MHz Arm® Cortex®-M33 core, offers 1 MB code flash memory, 256 kB SRAM, BGO/SWAP function, Ethernet, USB 2.0 Full-Speed, SDHI, QSPI, safety features, and advanced analog with one ADC unit.
The RA6E1 group is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept, called Flexible Software Package (FSP), using FreeRTOS as base, but can be replaced and expanded by any other RTOS or middleware user’s need.
The RA6E1 group is suitable for IoT applications requiring many connectivity options, large embedded RAM, 200MHz performance and low power consumption.
Features
- 200 MHz Arm® Cortex®-M33
- 1 MB Flash Memory and 256 kB SRAM
- 8 kB DataFlash to store data as in EEPROM
- 1 kB Stand-by SRAM
- Scalable from 48 pin to 100 pin packages
- Ethernet controller with DMA, USB2.0 FS, CAN 2.0B
- SCI (UART, Simple SPI, Simple I2C)
- SPI / I2C Multimaster interface
- QSPI, SDHI, SSI (Serial Sound Interface)
- TRNG and UniqueID
Benefits
- Value optimized feature integration by keeping essential high integration as well as large Flash and RAM for a wide temperature range of Ta = -40/85°C
- Entry-line connectivity integration with USB 2.0 Full-Speed device, Ethernet, serial communication, CAN, QSPI, and advanced analog
- Easy migration to mainstream-line with FSP and HW compatibility
Applications
- General purpose entry-applications
- Home appliance and building automation (Voice recognition, Panel control)
- Housekeeping MCU (Entertainment, Gateways, etc)
- HVAC (Heating, Air Conditioning, Boiler Control)
silica content library/npi/2021/renesas-ra6e1
Renesas RA6E1 Microcontroller Group | Avnet Silica
