STMicroelectronics ISM330DLC
STMicroelectronics ISM330DLC - iNEMO® 6-axis system-in-package with high accuracy and ultra-low power for Industry 4.0
Combining a 3D accelerometer and 3D gyroscope, ST’s ISM330DLC system-in-package is the latest generation of high-performance 6-axis MEMS inertial modules specifically designed for Industry 4.0. The ISM330DLC offers best–in-class accuracy and flexibility with ultra-low power consumption, enabling demanding applications, even battery-operated ones, in the industrial domain. High-performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the right choice for the implementation in reliable industrial products.
Key features
- Acceleration range: ±2/±4/±8/±16 g
- Angular rate range: ±125/±245/±500/±1000/±2000 dps
- Dedicated low noise, low latency signal processing path for stabilization control loop
- Embedded 4-Kbyte FIFO and smart functions
- Noise density (accel.): 90 µg/√Hz
- Rate noise (gyro.): 3.8 mdps/√Hz
- Embedded sensor hub
- I2C/SPI digital interfaces
- Temperature range: -40 to + 85 °C
- LGA-14 package (2.5 x 3 x 0.83 mm)
Applications
- Industrial IoT and connected devices
- Antennas, platforms and optical image and lens stabilization
- Robotics, drones and industrial automation
- Navigation systems and telematics
- Vibration monitoring and compensation
silica content library/npi/2018/stmicroelectronics-ism330dlc
STMicroelectronics ISM330DLC - iNEMO® 6-axis SiP | Avnet Silica
