Nexperia

 

 

 

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Nexperia is a leading expert in the high-volume production of essential semiconductors, components that are required by every electronic design in the world. The company’s extensive portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analog & logic ICs. We became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: more than 90 billion annually. Our extensive portfolio meets the stringent standards set by the automotive industry.

 

GaN FETs

Whether designing a motor drive/controller for the next generation of battery-electric vehicles, or a power supply for the latest 5G telecommunication networks, Nexperia’s GaN FETs will be key to your solution. Offering high power performance and high-frequency switching, the design and structure of our normally-off GaN FET products ensure standard, low-cost gate drivers can be used in your design. Discover more: https://www.nexperia.com/products/gan-fets.html

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To learn more about

  • Principle of operation and operating conditions
  • Efficiency & EMC tests

Watch the Demo Video below!

 

4 kW AC/DC 1-Phase
GaN based Bridgeless Totem-pole PFC converter

Features and benefits

  • Easy gate drive, low RDS(on) fast switching
  • Excellent body diode (Low Vf), low Qrr
  • High ruggedness
  • Low dynamic RDS(on)
  • Stable switching
  • Rugged gate bounce immunity (Vth ~ 4 V)

 

GAN063-650WSA - Power GaN FET 650 V
Nexperia GaN FET in TO-247 package VDS 650 V
VGS(th) typ 3.9 V
RDS(on) max 60 mΩ
RDS(on) typ 50 mΩ
Package TO-247 (SOT429)
EOSS 15 μJ @ 400 V
Qrr 125 nC @ 400 V -1000 A/μS
GAN041-650WSB - 2nd generation Power GaN FET 650 V
Nexperia GaN FET in TO-247 package VDS 650 V
VGS(th) typ 3.9 V
RDS(on) max 41 mΩ
RDS(on) typ 35 mΩ
Package TO-247 (SOT429)
EOSS 17 μJ @ 400 V
Qrr 150 nC @ 400 V -1000 A/μS

 

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Developing for the future:

We remain focused on the development of very high reliability-very high power GaN FETs, with continued development in:

  • Automotive qualification
  • 900 V and upwards
  • Half-bridge package solutions
  • Clip-bond packaging (CCPAK)
  • Bare die

 

Learn More

 

Related event

Nexperia Power Live Event
July 2-3, 2020

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