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Board name and key components |
Description and target applications |
Key features and benefits |
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KIT_LGPWR_BOM003
Power half-bridge board featuring OptiMOS™ power MOSFETs
OPN: KITLGPWRBOM003TOBO1
Infineon components:
- OptiMOS™ 5 80 V power MOSFET (IPT012N08N5)
- OptiMOS™ 5 60 V TO-leadless n-channel power MOSFET (IPT007N06N)
- OptiMOS™ 5 100 V power MOSFET (IPB017N10N5)
- OptiMOS™ 5 150 V power MOSFET (IPB044N15N5)
- OptiMOS™ 3 200 V power MOSFET (IPB107N20N3G)
- OptiMOS™ 3 250 V power MOSFET (IPB200N25N3G)
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The modular demonstration platform supports multi-phase topologies and variable half-bridge paralleling.
The power board demonstrates performance of Infineon’s power MOSFET family OptiMOS™ in D2PAK, D2PAK-7 and TO-leadless packages, in terms of parallelization and thermal behavior.
Interchangeable board approach:
Infineon strongly recommends using this board with
- master mother board (KIT_LGMB_BOM003)
- mother board (KIT_LGMB_BOM503)
- daughter board (KIT_LGDB_BOM003)
- capacitor board (KIT_LGCAP_BOM003).
Target use / applications:
Light electric vehicle (LEV) prototyping (Low speed electric vehicles, e-scooters, three-wheelers, golf carts, e-forklifts)
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Features:
- IMS PBC for increased cooling
- Basic software with GUI
Benefits:
- Scalability and versatility
- Rapid prototyping
- Fast building of customized solutions
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KIT_LGMB_BOM003
Master mother board featuring EiceDRIVER™ (2EDL23N06PJ) gate driver IC
OPN: KITLGMBBOM003TOBO1
Infineon components:
- EiceDRIVER™ 600 V half-bridge gate driver IC (2EDL23N06PJ)
- Voltage regulator (IFX91041EJV50)
- OptiMOS™ 3 30 V power MOSFET (BSZ086P03NS3 G)
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The master mother board (KIT_LGMB_BOM003) including Infineon’s EiceDRIVER™ half-bridge gate driver IC (2EDL23N06PJ) connects to the first power board (KIT_LGPWR_BOM003) and also provides supply for the XMC™ control card (Evaluation board KIT_XMC4400_DC_V1).
Interchangeable board approach:
Infineon strongly recommends using this board with
- power half-bridge board (KIT_LGPWR_BOM003)
- mother board (KIT_LGMB_BOM503)
- daughter board (KIT_LGDB_BOM003)
- capacitor board (KIT_LGCAP_BOM003).
Target use / applications:
Light electric vehicle (LEV) prototyping (Low speed electric vehicles, e-scooters, three-wheelers, golf carts, e-forklifts)
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Features:
- Gate resistors on FR4 for ease of rework
- Additional ceramic capacitor connected to the DC bus
- Optional branch out connection for paralleling of MOSFETs
Benefits:
- Scalability and versatility
- Rapid prototyping
- Fast building of customized solutions
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KIT_LGMB_BOM503
Mother board featuring EiceDRIVER™ (2EDL23N06PJ) gate driver IC for 2nd and 3rd phase
OPN: KITLGMBBOM503TOBO1
Infineon components:
- EiceDRIVER™ 600 V half-bridge gate driver IC (2EDL23N06PJ)
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The mother board provides the gate driver IC for 2nd and 3rd phase but it does not include the XMC™-connector.
Interchangeable board approach:
Infineon strongly recommends using this board with
- power half-bridge board (KIT_LGPWR_BOM003)
- master mother board (KIT_LGMB_BOM003)
- daughter board (KIT_LGDB_BOM003)
- capacitor board (KIT_LGCAP_BOM003).
Target use / applications:
Light electric vehicle (LEV) prototyping (Low speed electric vehicles, e-scooters, three-wheelers, golf carts, e-forklifts)
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Features:
- Gate resistors on FR4 for ease of rework
- Additional ceramic capacitor connected to the DC bus
- Optional branch out connection for paralleling of MOSFETs
Benefits:
Scalability and versatility
- Rapid prototyping
- Fast building of customized solutions
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KIT_LGDB_BOM003
Daughter board, interconnecting the gate driver and the power boards
OPN: KITLGDBBOM003TOBO1
Infineon components:
none
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This daughter board is supporting the LVD scalable power demo board platform. Its main function is to provide the system with the interconnection between the gate drivers and the power boards (MOSFET gates). It enables paralleling of the power boards by branching the interconnection of the gate driver signals, and providing each additional MOSFET the respective gate resistor. This board can only be used in conjunction with the LVDSPD mother boards and power boards, serving as the interconnection between the two categories when paralleling the power boards.
Interchangeable board approach:
Infineon strongly recommends using this board with
- power half-bridge board (KIT_LGPWR_BOM003)
- master mother board (KIT_LGMB_BOM003)
- mother board (KIT_LGMB_BOM503)
- capacitor board (KIT_LGCAP_BOM003).
Target use / applications:
Light electric vehicle (LEV) prototyping (Low speed electric vehicles, e-scooters, three-wheelers, golf carts, e-forklifts)
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Features:
- Gate resistors on FR4 for ease of rework
- Additional ceramic capacitor connected to the DC bus
- Connection for paralleling of MOSFETs
Benefits:
- Scalability and versatility
- Rapid prototyping
- Fast building of customized solutions
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KIT_LGCAP_BOM005
Capacitor board, PCB interconnecting the 12 capacitors for the DC bus
OPN: KITLGCAPBOM005TOBO1
Infineon components:
none
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This capacitor board is a supporting design for the LVD Scalable power demo board platform. It provides the system with an interconnection platform for leaded capacitors for the DC bus supplying the power half-bridges. This board can also be used in other lab setups requiring a DC capacitor bank in the range of up to 250V.
Interchangeable board approach:
Infineon strongly recommends using this board with
- power half-bridge board (KIT_LGPWR_BOM003)
- master mother board (KIT_LGMB_BOM003)
- mother board (KIT_LGMB_BOM503)
- daughter board (KIT_LGDB_BOM003)
Target use / applications:
Light electric vehicle (LEV) prototyping (Low speed electric vehicles, e-scooters, three-wheelers, golf carts, e-forklifts)
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Features:
- Connectors for DC bus copper bars
- 7.5 mm radial capacitor footprint
Benefits:
- Scalability and versatility
- Rapid prototyping
- Fast building of customized solutions
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