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Small Footprint, Big Impact

Nexperia Advanced Packaging saves PCB space

With rapidly evolving requirements, there is a pressing demand for smaller footprints now prevalent throughout most markets for electronic products. Space-saving, thermally efficient, and robust semiconductor packages are needed for transistors and diodes. And while for many product generations, designers have relied on established packages like the SOT23 and SMA families, we see the high performing clip-bond and leadless package outlines such as CFP and DFN clearly winning on value for money. These packages provide significant product diversity, covering single/dual configurations, thereby simplifying board design. CFP and DFN are suitable for a wide range of applications, including automotive, industrial, consumer, and computing applications.

Join us as we look at the space-saving components that are empowering automotive electrification and industrial advancements and the transition to power density packaging that is now underway.

 

Portfolio

  • DFN
  • CFP
  • Videos
  • Resources

Small Signal Bipolar in DFN

Longevity, cost-efficiency and high volumes

Nexperia invests in miniaturization to offer our customers the choice between leaded SMD and DFN variants. For applications where space is at a premium, e.g. mobile devices, wearables or automotive sensors or camera modules Nexperia recommends DFN packages.

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Nexperia DFN1412D-6 - front and back side

Schottky rectifiers in CFP packages

Highest efficiency by electrical performance

Ideal for automotive, industrial, consumer and computing applications, Nexperia's Schottky rectifier portfolio in CFP meets the challenging demands of efficient and space-saving designs. Clip-bonded FlatPower (CFP) packages with high power capabilities offer a true alternative to SMA, with better thermal performance.

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Nexperia's Schottky rectifiers in CFP packages

Trench Schottky rectifiers in CFP packages

Schottky rectifiers with low Qrr for high-speed switching applications

Nexperia Trench Schottky rectifiers in Clip-bonded FlatPower (CFP) packages meet the challenging demands of efficient and space-saving designs. They combine low reverse current, low forward voltage and lowest Qrr to enable best efficiency at high ambient temperatures. Available in three CFP package options with high power capabilities they offer a true alternative to SMA, with better thermal performance, on smaller footprint. For a range of automotive, industrial, consumer and computing applications – ideal in LED lighting, powertrain systems in hybrid vehicles and high-temperature applications.

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Nexperia's Trench Schottky rectifiers in CFP packages

Recovery rectifiers

Hyperfast recovery, space-saving devices

Nexperia’s recovery rectifiers deliver high power density while minimizing reverse recovery time and loss. For efficient switching and power conversion applications in automotive, industrial and consumer markets. Available in single and dual configuration and housed in Nexperia's clip-bonded FlatPower (CFP) packages.

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Nexperia's recovery rectifiers in CFP2-HP package

Introduction

 

DFN

 

 

CFP

 

 

Webinar

Power rectifier webinar series: The secret of efficient and compact clip-bond FlatPower (CFP) packages

Join Nexperia for a live session on November, 8th 2023. Nexperia will help you understand the importance of the right package choice when it comes to downsizing and design of PCBs, availability, and long-term supply security.

You will come away with knowledge about:

  • Modern power rectifier packages
  • Concept of Rth and total power dissipation
  • Impact of the thermal design environment: Optimal footprint design, layout and PCB
  • Benchmarking of different packages (SMx vs. CFP)

 

Register Now

 

 

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Nexperia PCB Space Right Package (LC)

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Blog series: How to choose the right package

A device's internal structure strongly affects the thermal resistance of different semiconductor packages, as do different operating conditions. To ensure circuits' safe and reliable operation and decide for the most appropriate package, designers need to understand thermal parameters and heat dissipation pathways. The blog series “Thermal considerations” guides through different semiconductor package types and the ‘thermal characteristics’ sub-section of the datasheet.

Thermal considerations

Selecting thermal-optimized semiconductor packages
Selecting thermal-optimized semiconductor packages

Meeting the heat dissipation requirements for an application requires designers to compare and contrast the thermal behaviour of different semiconductor package types.

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Understanding datasheet parameters: thermal characteristics
Understanding datasheet parameters: thermal characteristics

The ‘thermal characteristics’ sub-section of the datasheet for a semiconductor device includes information about its thermal behaviour in respect of different reference points and operating conditions.

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Crucial parameters for semiconductor thermal design
Crucial parameters for semiconductor thermal design

The structure of a small signal or medium power semiconductor device includes several subcomponents, each of which contributes to how it dissipates heat.

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