TE Connectivity MULTI-BEAM connectors

MULTI-BEAM power card edge connectors

TE Connectivity’s (TE) new MULTI-BEAM card edge connectors deliver the leading overall power and signal density to address data communication market requirements for performance, profile and cost. This next generation power card edge connector offers 30% density improvement compared to legacy products and better connectivity tolerance for more reliable connections. The exclusive TE design is modular and scalable to support greater flexibility in configuration and printed circuit board design.

TE Connectivity MULTI-BEAM power card edge connectors - Avnet Abacus

Features/Applications

Features   Applications
  • Achieve higher density with a 1.00mm signal contact pitch (up to 60% space savings) and 7.26mm power contact pitch (up to 30% space savings) 
  • Provide greater power per contact up to 43A 
  • Support two PCB thicknesses: 1.57mm and 2.36mm 
  • Help prevent solder bridging with more clearance between PCB pads and the signal contact 
  • Provide easier mating alignment with 1.3mm larger pads
  • Offer improved gatherability for blind-mate applications [+/-2.0mm (X), +/-1.54mm (Y)] 
  • Enhance scalability and modularity with common power and signal contact modules, different contact quantities and positions and AC/DC, low power and high power 
  • Enable easy mating/un-mating with proper retention force and low level contact resistance 
  • Available in vertical, right angle and straddle configurations
  • Data centers 
  • Telecommunications 
  • Industrial automation devices 
  • Power systems

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