Tria is a world leader in design and manufacturing of embedded computing. It helps OEMs to embed compute capabilities into their products of all shapes and sizes. From off-the-shelf compute modules to complete, custom-built systems, Tria makes technology for the world’s best products. With in-house design and manufacturing and a global footprint, Tria is uniquely positioned to support large multinational OEMs.
OEMs trust Tria to help them get their product to market faster, better and stronger. Faster, by speeding up development time with verified designs and modular solutions. Better, by leveraging cutting-edge compute and display technology. Stronger, with a global integrated supply chain and reduced costs. From coffee machines to robots, Tria has a proven track record for delivering success for some of the world’s best-known brands.
Tria is a wholly-owned subsidiary of Avnet, leveraging Avnet’s family of businesses and linecard suppliers to fulfil a broad range of secondary customer needs including component sourcing, software design, display solutions, server and datacentre solutions, cloud and IoT infrastructure.
Find out more about Tria's capabilities below, or if you would like to speak to an expert about how we can help with your Embedded requirements, visit avnet-abacus.eu/ask-an-expert.

IoT Smart Agriculture
Computer on Modules (COMs) are highly advantageous for smart agriculture applications due to their compact size, versatility, ruggedness and powerful computing capabilities.
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![]() | Tria MSC SM2S-QCS5430 The MSC SM2S-QCS5430 SMARC 2.1.1 module family ispowered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores | |
![]() | Tria MSC SM2S-QCS6490 The MSC SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm® QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight co | |
![]() | Tria MSC SM2S-EL The new MSC SM2S-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core archi | |
![]() | Tria MSC OSM-SF-IMX93 The MSC OSM-SF-IMX93 is based on the new OSM 1.1 standard (Size-S) “Small” for completely machine processible low-cost embedded computer modules during soldering, assembly and testing. Highly scalable and equipped with i.MX 93 Applications Processor | |
![]() | Tria QCS6490 Vision AI Kit The QCS6490 Vision-AI Development Kit features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device. High performance cores on the QCS6490 SOC include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexago | |
![]() | Tria ASUS Tinker Board R2.0 Tinker Board R2.0 series with its Quad Core Rockchip RK3288 SOC offers a superior performance level versus the most popular competing 1.8″” boards available in the market. An ARM-based Mali™-T764 GPU provided with the Tinker Board R2.0’s GPU enables |