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AI is increasingly moving from the cloud to the edge, driving additional needs in areas such as power management, sensors and microcontrollers, not just high‑end compute.

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Why Performance per Watt Is Becoming the Key Metric in Edge AI

By Michaël Uyttersprot - 2026年4月27日

In many deployments, systems must run continuously for extended periods without intervention, making reliability a primary design concern alongside performance.

TFT + NFC = Simplicity: Meet our newest integrated technology

By Stefano Rosato - 2026年4月24日

NFC technology began as a convenience-enabler, became normalized through payments and then fully came into its own during the pandemic.

Low power, high potential: our new Ultra Low Power TFT

By Stefano Rosato - 2026年4月24日

Our new Ultra Low Power TFT maintains performance even for reliability-critical battery-operated devices.

‘One and done’: The TFT display platform engineered to reduce time and costs

By Stefano Rosato - 2026年4月24日

The latest TFT display needs no host processor, and developers can work directly to the display platform.

DEEPX webinar image teaser shows DEEPX AI modules

Enabling Efficient Edge AI with DEEPX NPUs and the Avnet Silica Ecosystem

By Michaël Uyttersprot - 2026年3月17日

Learn how you can enable efficient Edge AI with DEEPX NPUs and the Avnet Silica Ecosystem.

Memory is Breaking Product Plans

By Alex Iuorio - 2026年3月6日

AI demand is reshaping memory supply, pricing and availability. What changed, why it matters and what OEM teams can do now.

Semiconductor market pulse: Six insights for Q1 2026

By Thomas Foj - 2026年2月12日

The latest on market trends, technology advances, and supply chain shifts shaping Q1 2026.

SQL Server IoT 2025: Bringing AI and Enhanced Analytics to Edge Data

By Yann Stridde - 2026年2月5日

Organisations are feeling increasing pressure to process information directly at the edge

Smart Agriculture Solutions

By Harvey Wilson - 2026年1月23日

Practical Innovations in Connectivity, Positioning and Edge Intelligence

'AI' illuminated on a AI semiconductor chip

FPGA vs GPU vs CPU vs MCU – hardware options for AI applications

By Michaël Uyttersprot - 2026年1月6日

Field programmable gate arrays (FPGAs) deliver many advantages to artificial intelligence (AI) applications. How do graphics processing units (GPUs) and traditional central processing units (CPUs) compare?

Turning control into clarity: our latest encoder with TFT

By Stefano Rosato - 2025年12月4日

Technologies tend to come full circle, but in this case we mean literally – combining an advanced rotary encoder (and encoder shell) with a 1.28-inch circular TFT display for a single, compact control solution.

Reimagining Automotive Design webinar spotlight

Reimagining Automotive Design - Next-Gen Memory & Interconnect Solutions

By Michael Pochmann - 2025年12月1日

In this session, we will explore how state-of-the-art memory and interconnect solutions are powering the development of safer, smarter and more sustainable vehicles, and helping visionary concepts become real-world innovations in automotive design.

Solar panels, wind turbines and electricity pylons

Driving the Green Revolution: 6 things every design engineer needs to know about Energy Management

By Harvey Wilson - 2025年9月10日

The way we generate, store, transfer, and consume energy is undergoing a dramatic transformation. As demand for electric energy surges, renewable sources such as solar and wind are being increasingly integrated into power grids.

Integrating AI in Smart Buildings

By Harvey Wilson - 2025年9月8日

The way we design, operate, and interact with buildings is evolving rapidly. With the rise of AI, IoT, and advanced analytics, buildings are transforming into intelligent, energy-efficient structures that can adapt in real time to occupant needs.

e-paper with IGZO: smarter, sharper and more sustainable

By Avnet Staff - 2025年8月20日

The latest generation of e-paper from Avnet Displays is smarter, sharper and more sustainable than ever

Back side of STMicroelectronics kit and background on MIPI DSI display

Big, bright, built for engineers: New Display Kits for ST Discovery Boards

By Avnet Staff - 2025年8月20日

We’re upscaling your options with new 7” and 10.1” display kits, designed to fit seamlessly with STMicroelectronics’ STM32F769I and STM32H747I Discovery kits.

Avnet Displays and SiS: delivering excellence together

By Avnet Staff - 2025年8月20日

We’d like to introduce you to Silicon Integrated Systems (SiS), whose specialized firmware and hardware meets our every expectation – and yours

Custom Power. Delivered Smarter.

By Avnet Staff - 2025年8月19日

Salom, a global leader in power supply design and manufacturing, had a clear strength: deep vertical integration.

Engineers wearing high-vis jackets walk past solar panels in a field

The Technologies Transforming Energy Management and Storage

By Harvey Wilson - 2025年6月24日

The demand for electric energy surges, renewable sources like solar and wind are increasingly integrated into grids.

Forging Ahead: A Partnership Driving Innovation in Battery Technology

By Avnet Staff - 2025年6月24日

In the dynamic world of electronics design and manufacturing, collaboration is often key to navigating complexities and seizing opportunities.

How USB-C is powering the future of electronics

By Avnet Staff - 2025年3月6日

To help engineers, designers, and industry professionals navigate these changes, Avnet Silica hosted an exclusive two-day webinar covering the latest developments in USB Type-C and USB PD 3.2.

Shaping the future of Healthcare - Avnet Silica's latest webinar series

By Harvey Wilson - 2025年1月20日

With the growing demand for personalised healthcare, remote monitoring, and advanced diagnostic tools, innovative electronics are paving the way for safer, smarter, and more efficient medical devices.

Nine reasons onsemi’s silicon carbide (SiC) solutions will revolutionise your power designs

By Avnet Staff - 2024年12月6日

If you’re looking to improve efficiency, boost performance, and future-proof your power systems, here are nine reasons why you should explore onsemi’s SiC solutions.

Taking the flexible approach to power conversion circuit design

By Philip Ling - 2024年12月6日

For a design engineer, everything can look like an application. And as any engineer will confirm, your design choices are always application-dependent.

How multiprotocol devices with increased security are changing the IoT

By Philip Ling - 2024年11月29日

The IoT has been evolving for more than two decades and we’ve been talking about security for just as long.

A group of colleagues working in a computer security room having a discussion

Advanced solution for kiosk devices with ARM architecture

2024年11月22日

CUSTOM S.P.A. seamlessly transitioned to Windows 10 IoT Enterprise on ARM64 for multiservice kiosks

The world's first 4 mOhm SiC JFET for circuit protection

Why your next relay or fuse could be a transistor

By Philip Ling - 2024年10月8日

We now have semiconductor substrates that can handle extremely high voltages and currents. But do transistor-based switches still have a place in the high-power domain?

EV on a charger, with selection of Microchip OBC products

Making more efficient on-board chargers

By Philip Ling - 2024年10月8日

The entire world is transitioning toward the electrification of everything, and the most impactful areas are where fossil fuels currently dominate.

The chips are down for chip down design in small to medium volume applications

By Harvey Wilson - 2024年9月16日

This article will compare the two approaches and show why module-based design is the best solution for the majority of small and medium volume applications.

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