TE Connectivity Pogo PIN connectors

As electronic devices continue to evolve with increasing performance demands, designers require interconnect solutions that can support dependable power and signal transmission across repeated mating cycles. TE Connectivity (TE) contact pads and pogo pins are engineered to work together as board level mating interfaces, helping enable consistent electrical performance and mechanical stability in a wide range of applications. Designed for repeated contact and efficient integration, these interconnects support consistent connections in designs where durability, space efficiency, and manufacturing compatibility are important.

Features

• Multiple diameters and heights to support a wide range of component layout and mechanical enclosure requirements
• Diameters: 1.5mm, 1.63mm, 1.98mm, 2.99mm
• Heights: 0.64mm, 0.8mm, 1.14mm, 1.4mm, 1.91mm
• Spring‑loaded contact for improved electrical performance
• Rated up to 1A per pin
• Supports up to 10,000 mating cycles
• Compact size suitable for space‑constrained designs
• Available in SMT and through‑hole mounting types
• Pogo pins and cable assemblies can be customized to meet customer specific requirements
• Full-metal construction with gold or platinum plating to support enhanced conductivity and oxidation resistance
• Helps to enable stable connections compared with simple copper foil
• Well-suited conductive mating surface for pogo pins, spring fingers, and test probes
• Flat, circular shape is suitable for SMT soldering
• Helps to enable automated production and streamline the manufacturing process

Applications

• Wearable devices (smart watches, earbuds, VR/AR)
• Docking and charging interfaces
• Portable device and testing measurement equipment
• Tablets, laptops, and handheld terminals
• Medical monitoring and diagnostic devices
• Smart home appliances