TE Connectivity NanoRF connector module for VITA VNX+ standard

TE Connectivity (TE)’s latest NanoRF connector modules for VNX+ designed per the VITA 90.7 draft standard offers advanced performance in many demanding aerospace and defense applications by providing high speed and density in a small form factor. The interface leverages the technology used in VPX systems, featuring a floating insert to pre-align RF contacts and mechanical transfers (MTs) before engagement. Radial and axial contact float helps assure final alignment of the contacts and keeps the contacts fully engaged for excellent RF performance under harsh environments. This product addresses the emerging need for small form factor packages to support applications such as radio transceivers, signal and graphics processors, network and fabric switches, and other I/O modules requiring coaxial or optical MT signaling.

Features

• Floating inserts on the backplane side with alignment features provide reliable, stub‑free mating
• No special tooling required for application or rework
• Fits standard VNX+ backplane apertures with a mounting design that accommodates varying backplane thicknesses
• Connector modules designed in alignment with evolving VITA 90 standards, enabling intermateability and interoperability across VNX+ compliant hardware suppliers
• High‑density package based on an open standard
• Leverages existing VPX NanoRF 50Ω and 75Ω contacts
• Small form factor supports SWaP‑C (size, weight, power, and cost) optimization

Applications

• Radar systems
• Electronic warfare and C5ISR
• Missile guidance systems
• Tactical communication equipment
• Small UAVs and spacecraft
• Drones