TE Connectivity HPI connectors product expansion

• Space-saving, low-profile design
• IDC and crimp cable termination options
• Helps save PCB real estate

TE Connectivity’s (TE) meeting the industry need for small centerline wire-to-board connectors with convenient insulation displacement contact (IDC) or crimp termination options, 0.8 mm low-profile High Performance Interconnect (HPI) connectors can be used in space constrained applications where signal or low power needs to be routed through a device. TE offers an extensive wire-to-board product offering that provides customers with design flexibility and versatility. The 0.8mm low-profile IDC connector system is designed to enable product compatibility with industry standard products though square-peg technology to provide solutions to customers that extend past the design-in cycle.

Features 

• Current rating: 1A
• High temperature plastic, UL94V-0
• Gold plating options available
• Compact 0.8mm centerline
• IDC and crimp cable terminations

Applications

• Internet of Things (IoT)
  • Security systems
  • Small appliances
  • Smart meters
  • Vending machines
• Data communications
  • Servers
  • Switches
  • Modems
• Consumer devices
• Automotive
  • Control units 
  • Infotainment systems
• Medical
  • Patient monitors
• Industrial automation