TE Connectivity 25G 0.5mm free height COM express connectors

• 25Gbps data rate, enabling PCIe Gen4 applications
• Same footprint to COM Express standards
• Reduce mating and unmating force by 30%

TE Connectivity’s (TE) new 25G 0.5mm free height COM express connectors extend TE’s portfolio by delivering faster data speeds - up to 25Gbps -improved signal integrity, and full backward compatibility with previous generations. They feature an enhanced mechanical design intended for easier installation, reduced mating and unmating force, and economic upgrade paths - no PCB footprint changes required. Multiple configuration options support diverse system requirements in embedded modules, switches, test and measurement, aerospace, and medical devices.

Features 

• Enhanced contact design can enable better signal integrity performance
• 25Gbps data rate, enabling PCIe Gen4 applications
• Improved mechanical design can reduce mating and unmating force by 30% compared to our previous generation products
• Same footprint to COM Express standards
• Not required to change PCB footprints when upgrading applications
• More position options - 40/80/120/160/220/440
• 5mm and 8mm stacking heights

Applications

• COM designs
• Other applications where vertical parallel board-to-board connections are needed, for example:
  • Embedding modules
  • Customized carrier/PC/control boards