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Hirose Electric IT18 series low profile BGA mezzanine connector

 

Hirose Electric announces IT18 series low profile BGA mezzanine connector

Hirose Electric announces IT18 series low profile BGA mezzanine connector

COM-HPC® standard compatible, ultra high density,​ low profile, BGA mezzanine connector​.

 

Features

  • COM-HPC® standard compatible connector (Version with weld tabs)
  • High speed transmission PCIe Gen5 (32GT/s), Gen6 (64GT/s PAM4), 100Gb Ethernet (4×25Gb)
  • Low profile design available in 5mm and 10mm stacking heights
  • High pin count and density: 400 positions (0.635mm pitch)
  • Open pin-field layout with flexible pin mapping for various system architectures
  • Reliable BGA rermination with pin-in-ball structure for high mounting reliability
  • Officially licensed COM-HPC® connector from Samtec

 

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Hirose Electric IT18 Series Low Profile BGA Mezzanine Connector | Avnet Abacus

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