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BOYD Thermalloy BGA Heat Sinks

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BGA heat sinks

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BOYD offers the broadest line of innovative BGA (Ball Grid Array) heat sinks to support all of your most demanding applications. They feature a wide variety of attachment methods and configurations. They are easy to install and most require no special board modifications.

Cost effective and highly functional, BOYD’s BGA heat sinks range in size from 10mmx10mm to 45mmx45mm, and accommodate heights from 6mm to 35mm.

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Features

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Cross-cut BGAs with push-pin attachment	Fluted Fin™	Clip attach E series
Configurations are available for a wide range of BGA package sizes All heat sinks utilise industry standard hole patterns Plastic push pins are standard. Consult Aavid Thermalloy for versions available with brass push pins for more rugged applications Most heat sinks utilise a phase change pad as the interface for optimal thermal performance Minimal diameter holes are necessary for mounting to PC board	Instead of straight edged rectangular pin fins, Fluted Fins™ are rippled and slightly staggered Design optimised for maximum performance in applications with limited or no airflow The fluting process enables the production of lighter weight heat sinks than those produced by conventional processes Suitable for use with double sided tapes and wire clip systems Possible performance gains versus cross cut products: 10mm high products upto 40% 16.5mm high products upto 30% 25mm high products upto 40%	2.5mm keep out zone for high density PCB layout Force applied by flexible wire spring No short-circuit concern from UL94V-0 rated PA66 Easy mounting Re-workable Shock & vibration tested Cost effective

Cross-cut BGAs with push-pin attachment

Fluted Fin™

Clip attach E series

Configurations are available for a wide range of BGA package sizes
All heat sinks utilise industry standard hole patterns
Plastic push pins are standard. Consult Aavid Thermalloy for versions available with brass push pins for more rugged applications
Most heat sinks utilise a phase change pad as the interface for optimal thermal performance
Minimal diameter holes are necessary for mounting to PC board

Instead of straight edged rectangular pin fins, Fluted Fins™ are rippled and slightly staggered
Design optimised for maximum performance in applications with limited or no airflow
The fluting process enables the production of lighter weight heat sinks than those produced by conventional processes
Suitable for use with double sided tapes and wire clip systems
Possible performance gains versus cross cut products:
- 10mm high products upto 40%
- 16.5mm high products upto 30%
- 25mm high products upto 40%