Laird BMI-S-608 shield frame

BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure sealing of the diecast housing ensures it will retain direct, surface-to-surface contact with high thermal load integrated circuits.

Features

• Enhanced design freedom involving PCB layout
• Permits reduction in spacing between adjacent shields
• Enables easier repairs of components
• Alternative to multi-component manufacturer solutions
• Base materials: stainless steel X10 CrNi18-8, (EN 1.4310)
• Surface plating or finish: pre-plated matte tin plating: from 2μm to 5μm
• Underlayer nickel: minimum 1μm
• Superior solderability and corrosion performance
• Version-dimensions: surface mount device frame 39,6mm 39,6mm, 7mm
• Operating temperature: from -40°C up to +125°C, Short-term +150°C
• Material thickness: 0.2mm
• Flatness or coplanarity: typically, <0.10mm

Applications

• Automotive, ADAS or AVS
• Infotainment smart boxes, radio navigation system, instrument cluster displays
• Higher power computing
• Central vehicle controllers
• Domain controllers