Industrial communication – the nervous system of the digital factory

The TCP/IP protocol is the common language in industrial networks for data exchange between machines, controls and IT systems; it connects classic automation with the connected world of IIoT and Industry 4.0. The trend is towards convergent architectures in which real-time communication, diagnostics and cloud connection come together over a uniform infrastructure.

The most important technology trends include industrial Ethernet as the dominant basis, the increasing use of OPC UA as an interoperable data interface, and TSN, which is intended to secure time-critical communication more precisely. Added to this is the growing importance of wireless connections, for example for flexible plant concepts, mobile systems and production environments that are hard to access. In parallel, IPv6 remains relevant, because the number of connected devices in the industrial environment continues to rise.

In semiconductor technology, the focus is above all on integrated network controllers, multi-protocol capable communication devices and energy-efficient edge components that can process TCP/IP data traffic robustly and with lower latency. Equally important are security functions directly in the chip, for example for encrypted communication and secured device identities, because connected production and IT integration increase the attack surface.

Time-Sensitive Networking (TSN) is developing in industrial networks from a specialist topic into a key building block for convergent Ethernet architectures: the technology brings real-time capability, predictable latency and precise time synchronisation to industrial communication, creating the basis for applications in which control, sensor and IT data come together on one network.

The most important trends include closer integration of TSN with OPC UA and PROFINET, the development of uniform configuration and QoS models, and progressive standardisation for industrial automation, for example via IEC/IEEE 60802. In parallel, the combination of TSN and network virtualisation is gaining importance, because manufacturers want to use it to create flexible, scalable and at the same time deterministic infrastructures for smart production.

In semiconductor technology, the current focus is above all on industrial SoCs and FPGAs that support TSN functions not only in software but also bring hardware for time synchronisation, scheduling, redundancy and determinism. For machine builders and automation specialists, this is decisive, because genuine TSN performance in the field can generally only be achieved with appropriate integrated network technology; standard Ethernet components alone are usually not sufficient.

Single Pair Ethernet (SPE) is developing into an important bridging technology in industrial communication between sensors, actuators and the cloud: transmission over just one twisted wire pair saves space, reduces cabling costs and therefore suits densely packed automation systems and compact robots particularly well. Central trends include greater continuity from field level into IT systems, the growing importance of PoDL for data and power over the same line, and increasing standardisation and interoperability around industrial Ethernet architectures. Added to this are more compact cables with smaller bending radii, greater ranges in relevant sub-applications, and new point-to-point and multidrop approaches that make SPE more attractive for Industry 4.0 and IIoT scenarios.

For semiconductor technology, what matters above all is that SPE needs robust, energy-efficient PHYs, suitable transceivers and integrated PoDL solutions that support industrial EMC requirements and long service lives in the field. At the same time, the focus is shifting to higher integration density, lower power consumption and a broader portfolio for different ranges and data rates, because SPE is developing from a pure cabling question into a system platform for industrial networks.

Wireless connectivity is increasingly becoming an enabler for flexible, mobile and scalable applications in industrial networks, wherever cabling is too inflexible, too expensive or technically impractical. Current trends are above all Wi-‑Fi 6/6E and Wi-‑Fi 7 with higher bandwidth and lower latency, private 5G networks for campus and plant communication, Bluetooth Mesh for robust IIoT topologies, LoRa for low-energy wide-area applications, and NB-IoT and Cat-M1 for narrowband, low-power edge connectivity.

In practice, the focus is thus shifting from pure range towards more deterministic communication, higher device density and better resilience. In manufacturing in particular, hybrid architectures are gaining importance, in which different wireless standards are combined depending on the application.

For semiconductor technology, the current focus is above all on energy-efficient wireless SoCs, high-performance RF front ends, integrated multi-band antenna solutions and security functions at chip level. In addition, system-on-chip approaches, edge-AI capable radio modules and optimised components for low latency and high robustness are driving development forward, because industrial wireless systems have to meet ever more complex requirements for performance, security and energy consumption.

Hardware-based cybersecurity for OT and IIoT nodes forms the technical foundation of secure industrial networks: it protects controls, sensors and gateways directly at chip level against manipulation, unauthorised access and lateral attacks within production environments. Instead of purely software-based measures, it moves cryptographic keys, identities and integrity checks into trusted hardware, an approach that is gaining importance particularly in view of increasing AI-supported attacks on PLCs and HMI systems.

The most important trends include the integration of hardware security modules (HSM) and trusted platform modules (TPM) into industrial communication controllers, the use of secure boot and firmware signing to prevent malware at field level, and the enforcement of zero-trust architectures through hardware-bound device identities. This is complemented by standardised security certifications to IEC 62443-4-2 and the increasing micro-segmentation of OT networks by means of hardware-supported access controls.

In semiconductor technology, secure element IPs for microcontrollers, hardware-accelerated crypto engines with side-channel resistance and the integration of physically unclonable functions (PUF) for keyless authentication are currently gaining particular relevance. These technologies make it possible to anchor security functions directly in IIoT chips in an energy-efficient and space-saving way, a decisive step towards security by design in industrial automation.

Advanced packaging techniques and 3D integration bring computing, communication and interface functions together in a small space and thus enable robust, compact and energy-efficient communication modules. Current trends are chiplet architectures, heterogeneous integration of logic, memory and analog functions, 2.5D and 3D stacking, and advanced substrates and new interconnect techniques for better signal paths and higher reliability.

For industrial communication, what counts above all is that such packaging approaches combine higher integration density with good heat dissipation and mechanical stability. This is important for communication modules in harsh environments, for example in machine controls, edge gateways or network nodes, where small size, temperature resistance and long service life have to come together.

In semiconductor technology, chiplet-based designs, thermally optimised 3D integration and packaging-related co-design approaches are currently considered particularly relevant. They support compact, high-performance communication modules that work reliably despite dense packing and fit into industrial networks with high demands on signal quality and robustness.