- RZ/T2H & RZ/N2H MPUs
- RZ/T2L & RZ/N2L MPUs
- RZ/G3S MPU
- DA14592 BLE SoC
- DA14594 BLE SoC
The Renesas RZ/T2H and RZ/N2H are advanced microprocessor units (MPUs) designed for high-performance industrial automation (IA) applications. These devices offer a powerful combination of application processing and precise real-time control, making them ideal for demanding motion control, robotics, and networked industrial systems. Both series feature high-speed communication interfaces, including PCIe Gen3 (up to 8.0 GT/s), dual CAN-FD channels, SD/eMMC host, and dual LCD controllers supporting WXGA (1280 × 800) at 60 fps. Enhanced security functions and abundant peripherals ensure robust and scalable solutions for a wide range of IA needs.
Products highlights
Renesas
RZ/T2H
RZ/T2H is an advanced high-end microprocessor (MPU) providing high application processing performance, high-precision real-time control, and Linux operations on a single chip.
Both RZ/T2L and RZ/N2L MPUs are designed to enable easy implementation of fast and accurate real-time processing with EtherCAT to enable energy-efficient and sustainable building and factory automation. The RZ/T2L MPU is equipped with Arm® Cortex® -R52 core, while the RZ/N2H MPU is equipped with both Cortex® -A55 and -R52 cores. The RZ/N2L MPU is designed as a network companion chip that can easily connect to existing systems with parallel or serial host interfaces.
Products highlights
The RZ/G3S MPU is designed to bring more power savings, and fast startup for Linux operations for IoT edge applications. The IoT edge computing can process data locally to optimize energy management and operational efficiency in smart and green buildings.
As a software platform for this product, Renesas provides the Verified Linux package, which includes the Linux Kernel, middleware drivers, and basic software for this product. The Verified Linux package is verified and provided by Renesas.
Products highlights
Renesas
RZ/G3S
General-Purpose Microprocessors with Single-Core Arm Cortex-A55 (1.1GHz) CPU and Dual-Core Cortex-M33 (250MHz) CPU, Supporting Low-Power Mode and PCI Express.
The DA14592 is a dual-core Bluetooth® Low Energy 5.2 System-on-Chip (SoC) designed for ultra-low power and compact IoT applications. Featuring Arm® Cortex®-M33 and Cortex®-M0+ cores, it integrates 256 KB Flash, 96 KB RAM, and advanced peripherals, while requiring only six external components. With best-in-class radio efficiency, hibernation current as low as 90 nA, and support for QSPI memory expansion, it enables cost-effective, feature-rich designs for asset tracking, connected health, and smart devices.
Products highlights
Renesas
DA14592
SmartBond Multi-Core Bluetooth LE 5.2 SoC with Embedded Flash. The DA14592 is a mid-range Bluetooth LE SoC that offers the lowest power consumption and smallest solution footprint in its class.
The DA14594 is a dual-core Bluetooth® Low Energy 5.3 System-on-Chip (SoC) optimized for ultra-low power and advanced locationing applications. Featuring Arm® Cortex®-M33 and Cortex®-M0+ cores, it integrates 256 KB Flash, 96 KB RAM, and 288 KB ROM with QSPI expansion. With best-in-class power efficiency (hibernation <100 nA), secure boot, and support for Locationing 2.0 (AoA/AoD, WiRa™), DA14594 enables scalable asset tracking, connected health, and IoT designs requiring long battery life and high precision.
Products highlights
Renesas
DA14594
SmartBond Dual-Core Bluetooth LE SoC (Qualified Against Bluetooth Core 5.3) with Embedded Flash.
Resources
Renesas Winning Combinations links
Shaping the Electric Future Together
Invest in a sustainable, efficient and connected world – with EBV. Our semiconductor solutions are key to
successfully realising the All Electric Society – from mobility to energy and industry.
Get in touch with us and help shape the future of electrification.