Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
Ultra rugged features, flexible power systems, rugged contacts, and rugged signal integrity solutions are the foundation of Samtec’s Rugged/Power product line. Designed for high cycle, high power and high speed applications, products are available with full engineering support and free online design tools.
These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).
Features
- Best in class density for power and signal
- Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL® 3.1 capable
- Open-pin-field design for grounding and routing flexibility
- High-density multi-row design
- Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap
- 4 or 8 total power blades; up to 10 in development
- 60 or 240 total signal positions; additional position counts in development
- 0.635 mm signal pitch
- Optional alignment pins
- Standard weld tabs for a secure connection to the board
- Polarized guide posts for blind mating
Applications
- AI/ML
- Automotive & Transportation
- COMPUTER
- Mecical
- Energy
- Industrial/IIoT
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