TE Connectivity Z-PACK HM-ZD high speed backplane connector

TE Connectivity (TE)’s, Z-PACK HM-ZD connector portfolio provides data rates of up to 56Gbps while retaining backwards compatibility with previous versions of the HM-ZD family to allow for easier upgrades in the field. Relevant for Advanced Telecommunications Computing Architecture (ATCA) next-generation applications including options for traditional and co-planar architectures, the Z-PACK HM-ZD product family is well suited for data center applications including servers and routers, as well as test and measurement, medical imaging devices and industrial automation.

Features

• Headers and receptacles of different data rate versions are compatible with each other
• Integrated pre-alignment features and polarization built into a robust mating design, with robust ground shields promoting mechanical durability
• Durability up to 200 mating cycles (max) with 50G mechanical shock resistance
• Operating temperature from -55°C to +105°C
• Density up to 40DP/inch
• Z-PACK HM-eZD++ connectors support data rates of up to 56Gbps with better electrical performance
• EZD++ connectors have smaller plated through-hole size (minimum 0.31mm for signal pin, 0.36mm for ground pin), allows for better design flexibility, and better high frequency performance

Applications

• Server solutions
• Switching and routing
• Data centers
• Test and measurement
• Industrial automation
• Medical imaging