TE Connectivity SolderSleeve devices for space applications

TE Connectivity (TE)’s SolderSleeve device for space is our response to support the critical requirements of the space industry. This product is designed and developed for applications within this vertical market (including LEO satellites) which require low outgassing and resistance to extreme temperatures. SolderSleeve device for space helps provide reduced size, weight and power (SWaP) and environmentally protected shield termination on cables as well as insulation, protection and strain relief. This product can be used for splicing wires as well as shield terminations. The space industry also demands solutions which have minimal to zero levels of foreign object damage (FOD) in key applications.

The use of flux free solder leaves no traces of particles post installation and the sealing rings helps ensure that the installation remains intact.
SolderSleeve device for space can be used for silver plated cables. In addition, standard tools such as the heat gun and reflector will work and follow the RCPS-100-70.

Features

• Heat shrinkable technology for one-step shield results in easy inspection
• Transparent insulation sleeve saves time during installation
• Provides strain relief with ratings of up to +150°C
• Minimal tools required to achieve connection, insulation and protection
• Inhouse design and quality controlled process offers reliability and traceability

Applications

• Small, nano and cube satellites for LEO constellations
• Launch pads