TE Connectivity SFP56 series zSFP+ stacked interconnects

TE’s new zSFP+ stacked Interconnects are designed to transfer data rates at up to 56 Gbps PAM-4 while offering high faceplate density for hyperscale data centers and networking switch applications. The stacked portfolio can accommodate 3 row belly-to-belly applications for increased density and maximum PCB space savings.

Features

• Each of the products in TE's SFP portfolio of I/O interconnects is designed to transfer data at speeds of up to 28 Gbps NRZ and 56 Gbps PAM-4 signal
• The stacked portfolio can accommodate 3 row belly-to-belly applications for increased density and maximum PCB space savings
• Shares the same mating interface and cage dimensions with the entire SFP28 portfolio
• Allows for a simple upgrade path from 28 Gbps to 56 Gbps applications
• Enhanced airflow cage design can provide great thermal performance and can be customized to address customer’s LED light pipe requirements

Applications

• Switch
• Server
• Router
• Storage
• Test equipment