TE Connectivity SFF-TA-1002 series

TE Connectivity (TE) sliver interconnects for SFF-TA-1002 are flexible, robust and provide optimal signal integrity – while also saving space and helping to lower design costs. With a 0.6mm contact pitch, Sliver products are super slim, allowing you to fit more inside the box and still have plenty of room for cooling. In addition to card-edge configurations, TE provides a highly robust metal housing design on the connector cage to help withstand cable pull, while an active latch provides additional connection security.

Features

• Design aspects of sliver connectors were adopted into SFF-TA-1002 specification and Sliver cable into SFF-TA-1020 specification, due to the sliver product performance, density, flexibility and robustness
• Robust ecosystem - SFF-TA-1002 and SFF-TA-1020 specifications also are adopted by various industry standards including EDSFF, PECFF, OCP NIC, DC-XPI
• Meets all current protocol performance requirements for PCIe Gen3 or Gen4 (8G and 16G), SAS 3 or 4 (6G, 12G and 24G), Ethernet protocols (10G and 25G per lane), InfiniBand (28G), EDSFF, PECFF and meets performance for IEEE and IOF 56 Gigabits per second (Gbps), PCIe Gen5 and SAS
• Rated up to 56G PAM-4 (112G) speeds with PCIe Gen6 capability
• Sizing options include 1C (x4), 2C (x8) and 4C or 4C+ (16) in both right angle and vertical sizes. All module cards can plug into any alternative configuration by design. Non-standard variants are also available in x32 and x16 + high power

Applications

• Artificial Intelligence (AI) or machine learning
• 5G infrastructure
• Cloud computing
• Data center servers and networking equipment
• Telecommunications