TE Connectivity multi-point IDC terminals

• Allow simultaneous multi-point connections with a single press
• Significantly reduces the need for wire preparation (stripping) before termination

TE Connectivity (TE)’s multi-point IDC (Insulation Displacement Contact) terminals provide reliable wire-to-board connections in miniaturized applications like sensor units, amplifier units, retrofit LED lamps, medical equipment, mobile devices and smart metering equipment. The surface mount (SMT) IDC terminals facilitate fully automated board assembly and significantly reduces the preparation (stripping) of wires prior to termination due to its IDC contacts. As a result, costly and unreliable hand soldering can be avoided as the discrete wires can be processed reliably and reproducibly. IDC terminals are available for stranded wires of different outer diameters (AWG 24/26). In spite of their compact dimensions, the IDC terminals can support a maximum current carrying capacity of up to 8A at 20°C for AWG 24/7. Multi positions with 2P, 4P and 5P are available and IDC terminal helps enable multi-point connection by one time press.

Features 

• Ultra-low profile, microminiature PCB layout
• Up to 8A current carrying capacity (2P)
• Dual IDC contacts
• User-friendly wire termination
•  Pick and place tape is available for SMT process

Applications

• Sensor and amplifier unit
• Display component of small industrial devices
• LED lamp
• Medical equipment
• Mobile devices