TE Connectivity Mezalok high-speed low-force XMC connector

TE Connectivity’s (TE) Mezalok high-speed low-force (HSLF) XMC connectors are designed for mezzanine applications for rugged embedded computing interconnects. The connectors utilize a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high speed connectors. The connectors are available in 60, 114, and 320 positions with stack height options of 10mm, 12mm, 17mm and 18 mm. Mezalok high-speed low-force XMC connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant to VITA 61 and additional positions and stack heights are available. These high-speed low-force connectors feature a wide operating temperature range, excellent thermal stability, and data rates to 32+Gb/s, with VITA 42.3 pinout. Mezalok high-speed low-force connectors utilize the reliable ball grid array printed circuit board surface mount application.

Features

• Unmating force reduction: 47%/mating force reduction: 32%
• Rugged dual point contact system
• Maintains ball grid array (BGA) PCB attachment, supports standard surface mount processing
• Designed for highly rugged performance rating—meeting legacy Mezalok specification
• Testing to VITA 72 working group environment
• Thermal stability for reliable solder joints
• Multiple positions and stack heights available

Applications

• Embedded computing