TE Connectivity low temperature rise cluster block

TE Connectivity (TE) has developed the low temperature rise cluster block to help air conditioner manufacturers meet compressor operating temperature requirements with a quick, easy and reliable connection. The cluster block design provides up to 28% lower temperature rise than current standard offerings. The solderless connection provides a cleaner assembly than comparable soldered solutions and the hermetic pin alignment feature supports easier automated assembly.

Features

• Hermetic pin alignment feature supports easier assembly and fully automated processing
• Housing stopper design reduces connector rotation risk by fixing mating part position after insertion
• Gap design between the terminal and housing increases reliability and provides better low level contact resistance (LLCR)
• Cleaner assembly with solderless mating

Applications

• Air conditioner compressor (exterior)