TE Connectivity DIP sockets and SIP sockets

• Support quick mating and un-mating 
• Enable easy replacement of the IC 
• Minimize the risk of IC overheating during soldering
• Provide improved vibration resistance with multi-contact beam design

TE Connectivity (TE)`s DIP (Dual In-Line Package) socket provides a separable electrical and mechanical connection between an electronic component and a Printed Circuit Board. DIP sockets enable easy replacement of components received by such sockets. Use of DIP sockets also can minimize the risk of damage to components received by the sockets that might occur if the component were directly soldered to the PCB.

TE’s SIP (Single In-Line Package) socket with machined female header provides a highly reliable connection between the integrated circuit device and PCB. Compared with dual in-line package (DIP) socket, SIP socket typically more compact, enabling it to handle higher-density configuration.

Features

• Support quick mating and un-mating 
• Enable easy replacement of the IC 
• Minimize the risk of IC overheating during soldering 
• Provide improved vibration resistance with multi-contact beam design 
• Durability up to 500 cycles with gold plating 
• Support flame resistance with UL 94V-0 rating with PPS (polyphenylene sulfide) housing 
• Offer various specifications to address customer demands

Applications

• DIP sockets
  • Industrial controls
    • Park machine
    • CNC mill machine
    • Test and measurement equipment
    • Rail signal monitor 
  • Intelligent buildings
    • Elevator
    • Intelligent security locks 
  • Medical devices
    • Magnetic Resonance Imaging (MRI)
    • Ultra sonographs
    • Patient monitort 
  • Military and aero 
    • Flight control and landing gear systems
    • Military marine
• SIP sockets 
  • PLC and control cabinet 
  • Industrial computing and computer 
  • Communication interconnection