TE Connectivity 16G 0.5mm free height stacking COM connectors

TE Connectivity's (TE) generation of 0.5mm Free Height (FH) stacking connectors are complaint with the COM Express Type 7 specification and offer data transmission up to 16 GT/s. They serve as the connection between next-gen CPUs and carrier boards and are an economic solution with high speed and excellent SI performance to address the need for upgrading COM Express applications.

Features

• Faster data speed—up to double previous generations with compatibility to PCIe Gen. 4 applications
• New contact design enables better signal integrity when compared to their previous generation products and to most in the market
• ~30% improvement in mating/unmating force enables easier operation
• Same footprint as COM Express standard interconnect means there is no need to change PCB footprints when upgrading applications
• Multiple configurations enable system design flexibility

Applications

• COM Express modules
• Other applications that need vertical-to-vertical parallel board-to-board connections, e.g.:
  • Embedding modules
  • Customized: carrier, PC, control boards