Samtec UDX6 series high-density, high-speed power/signal arrays
Samtec announces UDX6 series high-density, high-speed power/signal arrays
Blades rotated 90ºC have equal access to heat escape for uniform cooling, increased current capacity and reduced crowding.
Features
- Best in class density for power and signal
- Rotated power blades improve performance and simplify breakout region (BOR)
- Open-pin-field design for routing and grounding flexibility
- Low profile 5mm stack height; up to 16mm in development
- Up to 8 power and 240 signal positions; additional position counts in development
- 0.635mm signal pitch
- Supports 64Gbps PAM4 (32Gbps NRZ) applications
- PCIe® 6.0/CXL™ 3.1 capable
- Weld tabs included for a secure connection to the board
- Polarized guide posts for blind mating
- Optional alignment pins
