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Molex

NPI Body

Molex wire-to-board and wire-to-busbar interconnects

Molex announces wire-to-board and wire-to-busbar interconnects

SW1 wire-to-board and wire-to-busbar interconnects incorporate COEUR socket technology which enables a high-current-carrying capacity in three sizes: 6.00mm (120.0A), 8.00mm (185.0A) and 11.00mm (300.0A) with a unique positive-locking design for secure mating.

Features

Multiple contact beams with optimal current-carrying capacity
- Provides low contact resistance, low voltage drop, and minimal heat generation at the contact interface
Color-coded receptacle housings
- Help to differentiate circuits and to prevent mis-mating when multiple cable assemblies are used on the same application
Positive-locking stainless steel spring clips
- Help secure mating to prevent cable assemblies from backing off pins due to shock, vibration or mishandling; stainless steel spring clips retract when pressed and engage once the pressure is released to lock into groove on pin
Compact design
- Offers significantly lower height and significantly shorter length than competitor’s 8.00mm size receptacle assemblies, resulting in a connector that is better suited for applications requiring tight spaces
Design flexibility
- Offers designers options for attaching pins to different substrates
  - Screw-mount pins attach to either printed circuit boards or busbars
  - Knurled press-fit pins attach to busbars
Reliable crimp geometry with high-quality 8-sided crimp profile
- Helps ensure minimal contact resistance at the interface between the wire and the crimp barrel; contributes to the system’s minimal heat generation in higher currentcarrying capacity compared to other designs
Quick connect or pinch-torelease cable assemblies
- Offers enhanced functionality in tight spaces; can be mated, locked or unlocked and unmated with a single hand by pinching the ergonomic ribs