Molex SpeedEdge edge-card and mezzanine connector system

Features

• Mechanically robust with thicker walls and higher stack height when compared to SpeedStack™
• Connectors and other mezzanine systems
• Split-pad PCB design
• Design includes contacts with gradual lead-in
• Multiple circuit sizes (22, 60 and 82) with a range of 6 to 32 differential pairs
• Low profile (as low as 7.00mm)
• Shares the same footprint as SpeedStack™ receptacles
• Compatible with SpeedEdge™ Plug for a robust mezzanine solution
• 92-Ohm impedance
• 85-Ohm impedance versions in development
• Robust insert-molded wafer with protected shrouded housing
• Securely holds thick PCBs; delivers durability and high-mating cycles
• Allows for electrical tuning performance to reach data rates to over 40 Gbps per differential pair
• Lessens risk of contact stubbing and supports highmating cycles. Accommodates PCBs with blunt chamfers
• Offers high-density signal solution with flexible pin counts
• Delivers superior signal integrity performance via optimal airflow. Provides real estate savings in space-constrained applications
• Drop-in replacement for rugged edge-card applications
• Provides high speed and design flexibility to address PCB space constraints
• Provides superior impedance control
• Will support PCIe Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for next-generation I/O and memory signaling
• Provides support to the terminal location to improve electrical balance within the signals for low-profile, high-density systems

Applications

• Telecommunication Applications
  • Remote radio antennas
  • Base stations
  • Mobile
• Networking
  • Servers
  • Routers
  • Switch
  • Storage
• Military and Medical
  • Scanning equipment
• Consumer
  • Camera
  • Handheld scanners
• Automotive
  • Front camera module
  • Infotainment unit