Molex sentrality pin and socket interconnect system

Molex’s sentrality pin and socket interconnect system offers high-current board-toboard, busbar-to-board and busbar-to-busbar connectors and provides a + or - 1.00mm radial self-alignment to overcome tolerance stack-up issues. 

Features

• Low contact resistance
  • Provides multiple contact beams to minimize heat generation at the contact interface, resulting in optimized electrical performance
• Compact conical socket design
  • Allows for tighter board-to-board stack heights with shorter socket assemblies than most market equivalents using hyperbolic sockets
• Self-aligning sockets float between wave springs
  • Allow the socket to freely move radially + or - 1.00mm within the socket assembly during mating, to help ensure no contact beam deformation
• The screw-mount pins attach to both printed circuit boards and busbars; the surface-mount pins attach to printed circuit boards; the knurled press-fit pins attach to busbars
  • Offer design flexibility for attaching pins to various substrates
• The eye-of-needle sockets and the surface-mount sockets attach to printed circuit boards; the knurled press-fit sockets attach to busbars
  • Offer design flexibility for attaching sockets to different substrates the contact interface, resulting in optimized electrical performance
• Top-entry socket assemblies and bottom-entry socket assemblies
  • Offer design flexibility, allowing designers to stack substrates top-of-board to top-of-board configurations or top-of- board to bottom-of-board configurations, based on applicationspecific requirements 
• Surface-mount pins with pick-and-place caps placed in trays
  • Allow for manufacturing flexibility with high-speed automated placement
• Knurled press-fit pins and screw-mount pins packed in trays
  • Allow for manufacturing flexibility with manual placement options
• Surface-mount sockets with pick-and-place caps are packed in tape-and-reel arrangements
  • Allow for manufacturing flexibility with high-speed automated placement
• Knurled press-fit and eye-of-needle sockets are packed in trays
  • Allow for manufacturing flexibility with manual placement
• Socket assembly’s flange can be positioned anywhere along the side of the part
  • Allows for easy customization in achieving the optimum application specific protrusion above and/or below the substrates
• Pin length can be set
  • Allows for easy customization in achieving the optimum applicationspecific desired board-to-board or busbar-to-board stack height 

Applications

• Telecommunication or networking
  • Servers
  • Data storage units
  • Power distribution units (PDUs)
  • Uninterruptible power supplies
  • Digital cross-connect switches
  • Network routers
• Industrial automation
  • Battery charging stations
  • DC-to-AC inverters
  • AC-to-DC rectifiers
  • Robotics
• Data centers
  • Enterprise switches
  • Servers
  • Data storage units
  • Power shelves
  • Power distribution units (PDUs)
  • Uninterruptible power supplies
  • Environmental control equipment