Molex PowerWize BMI blind-mating panel-to-board connectors

PowerWize BMI blind-mating panel-to-board connectors incorporate Molex’s COEUR socket technology, which helps ensure low contact resistance at the mating interface to minimize heat generation and enable high current-carrying capacity. It is available in three sizes: 3.40mm (75.0A), 6.00mm (110.0A) and 8.00mm (175.0A). The blind-mating design helps ensure accurate mating in hard-to-reach and visually obscured spaces

Features

• Optimal current-carrying capacity with multiple contact beams
  • Provides low contact resistance, low voltage drop and minimal heat generation at the contact interface
• Self-aligning panel-mount receptacle flanges
  • Accept either force-fit standoffs paired with bolts (used when the assembler only has access to one side of the panel) or shoulder screws paired with nuts (often used when the assembler has access to both sides of the panel), allowing the panel mount receptacle +/- 2.00mm of radial float to mitigate tolerance stack-up issue
• Field installable battery-powered applicators
  • Enable on-site cable assembly fabrication for applications where cable assembly lengths are uncertain until installation is underway
• Blind-mating guideposts
  • Enable the inner wall of the header shrouds to align the connectors during mating, facilitating trouble-free mating in drawer-style applications where the connectors are obscured
• Mechanical keying with unique geometry at the front of the panel-mount receptacle and matching geometry on the panel cutout
  • Helps ensure the receptacle is installed in the proper orientation
• Screw-mount pins attached to both printed circuit boards and busbars; solder tail pins attached to printed circuit boards
  • Offers options to attach pins to different substrates for design and manufacturing flexibility
• Crimp contacts available to accept a wide range of wire gauges (from 10AWG to 1/0 AWG)
  • Provides design and manufacturing flexibility
• Reliable crimp geometry eight-sided crimp profile
  • Helps ensure minimal contact resistance at the interface between the wire and the crimp barrel, contributing to the system’s minimal heat generation and higher current-carrying capacity compared to other designs
• Secondary substrate attachment
  • Achieves additional board retention (if desired) by attaching the right-angle header to the substrate using M3 bolts, nuts and the two mounting flanges molded into the body of the header
• Mechanical keying with unique geometry at the front of the panel-mount receptacle and matching geometry on the header shroud
  • Helps prevent mismating between the receptacle and header
• Mechanical keying with crush/locating pegs on headers
  • Helps ensure right-angle headers are properly oriented on printed circuit board or busbar
• Terminal backout assurance
  • Provides two (opposed) positive locks that hold the TPA retainer securely to the blindmate receptacle housing silo
  • Helps prevent the crimp contact from backing out of the receptacle with six beams robustly holding the crimp contact inside the TPA retainer
• User-friendly cable assembly build
  • The contact is crimped to the stripped wire. The TPA retainer slips completely over the crimped contact and its beams are positioned against the rear of the contact flange.
  • The subassembly is then inserted into one of the panel mount housing silos with the TPA retainer locking into place and generating mechanical feedback and an audible click to help ensure the crimped lead contact is fully engaged and minimizes the opportunity for terminal backout.

Applications

• Telecommunications or networking
  • Servers
  • Data storage units
  • Power distribution units (PDUs)
  • Uninterruptible power supplies
  • Digital cross-connect switches
  • Network routers
• Data centers
  • Enterprise switches
  • Servers
  • Data storage units
  • Power shelves
  • Power distribution units (PDUs)
  • Uninterruptible power supplies
  • Environmental control equipment
• Electric vehicle charging stations
  • Inverters