Molex Mirror Mezz Pro 112Gbps mezzanine connectors

Footprint-compatible, hermaphroditic Mirror Mezz 15OCP x 11OCP connector lowers application costs with stackable mating that supports data speeds up to 112Gbps per differential pair. 

Features

• Robust shrouded housing design
  • Encapsulates the pin field, protecting the pins and offering blind-mate guidance to eliminate any possibility of mis-mating
• Stitched BGA design
  • Offers greater cost savings than insert-molded BGA attachments. Stitched contact structure reduces lead times and the connector design simplifies product matrix 
• Contact beam structure of a mated combination
  • Prevents vibrations and terminal lift to ensure a constant 2-points of contact for electrical reliability. Beam geometry offers reliable normal force for harsh environments and 1.50mm of nominal contact wipe to ensure sufficient engagement
• Flex cable links
  • Offer cost savings and excellent SI with controlled channels and pinned grounds
  • Enable relaxed tolerancing for offsets between boards and flexible architectures
• Intricate terminal structure design
  • Provides numerous mechanical strengths while also benefiting from cutting-edge electrical features, for some of the fastest speeds in the industry
• Wide ground pins
  • Balance the electrical field and shield the differential pair from surrounding transmission lines
• 2 electrically tuned signal contacts
  • Cleanly transmit highspeed signals for maximum signal integrity surrounding transmission lines
• Precise arranged combination of signals and grounds
  • Maximizes high-speed performance and clean routing out of the connector footprint, with precisely arranged and populated pin fields transmission lines
• Different paddle-to-contact bend direction between the rows
  • Minimizes the cross-talk between rows
• BGA attached and consistent ball profile
  • Leads to improved and Stitched contacts more predictable SI
• Stitched contacts
  • Provides lower costs and is more customizable than insert molding
• Contact differences between rows; paddles have a bend direction to contact alternates
  • Minimizes crosstalk between rows (1.50mm-row pitch) 
• "Stubless" contact interface
  • Offers superior SI performance with minimum stack height of 5.00mm and two points of contact on every beam for reliability 

Applications

• Data or computing
  • Servers
  • Networking
  • Storage 
• Telecommunications or networking
  • Infrastructure
  • Networking