Molex 211964 series 2.4, 5 GHz ceramic and MID chip antenna
Molex's has introduced 211964 series 2.4, 5 GHz ceramic and MID chip antenna
2.4 and 2.4, 5 GHz Ceramic and LDS-MID antennas offer outstanding performance and easy integration in connected city and home applications.
| Product and Technical Differences | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
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Attribute |
2.4, 5 GHz Ceramic SMT Antenna (Series 211964) |
2.4, 5 GHz SMT MID Chip Antenna (Series 146175) |
2.4 GHz SMT MID Chip Antenna (Series 47948) |
2.4 GHz SMT Ceramic Antenna (Series 206513) |
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| Size | 3.20(L) by 1.60(W) by 1.20(H) mm | 5.00(L) by 3.00(W) by 4.00(H) mm | 3.00 by 3.00 by 4.00mm | 3.00 by 3.00 by 4.00mm | ||||||
| PCB Keep-out |
6.00(L) by 4.00(W)mm | 6.00(L) by 4.00(W)mm | 4.00 by 4.00mm | 4.00 by 4.00mm | ||||||
| Material | Ceramic | MID-LDS | MID-LDS | Ceramic | ||||||
| Antenna Type |
Loop | Loop | Monopole | Monopole | ||||||
| Frequency Range |
2.4 to 5 GHz | 2.4 to 5 GHz | 5.15 to 5.85 GHz |
2.4 GHz | 5 GHz | 2.4 to 2.5 GHz | 2.4 GHz | |||
| Return Loss | <-6 dB | <-5 dB | <-5 dB | <-6 dB | <-7 dB | <-6 dB | ||||
| Peak Gain | 2.7dBi | 2.1dBi | 2.2dBi | 3 dBi | 4.2 dBi | 3.3 dBi | 3.0 dBi | |||
| Total Efficiency |
>80% | >70% | >65% | 70% for both 2.4 and 5 GHz | >70% | >55% | ||||
| Polarization | Linear | Linear | Linear | Linear | ||||||
| Operating Temperature |
-40 to +85°C | -40 to +125°C | -40 to +125°C | -40 to +125°C | ||||||
| Key Advantages | Single band and dual band. High operating efficiency | Small clearance zone; high RF performance; dual-band; halogen-free |
Miniature in size but big in RF performance |
Miniature and identical in size with series 47948 |
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| Symmetrical radiator design offers significant design flexibility by allowing reversed lateral placement on the PCB without affecting radiation pattern or performance |
Laser Direct Structuring (LDS)-formed circuitry yields high, consistent RF performance, leveraging the excellent laser structuring precision, speed, accuracy and repeatability of LDS technology |
Environmentally sustainable halogenfree LDS-MID housing withstands high reflow temperatures during assembly processing |
Cost-economical | |||||||
Applications
- Connected Home
- Smart appliances
- Energy and utilities
- Security and surveillance
- Wireless Infrastructure
- Wireless solutions
- Commercial Vehicles
- Networking
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