Molex NearStack 100-Ohm 203316, 206138, 207244, 207249 series
Molex announces NearStack 100-Ohm 203316, 206138, 207244, 207249 series
Enabling speed upgrades in space-constrained telecommunications and data center applications tuned for 100-Ohm impedance, NearStack 100-Ohm connectors and cable assemblies deliver a dense, low-profile, near-ASIC cabled solution for jumper-type and I/O BiPass connections up to 56Gbps PAM-4.
Features
- Reduces insertion loss for high-speed data applications
- The double-ground structure between differential pairs (DPs) and direct-to-contact weld termination removes the paddle card and improves electrical performance for 56Gbps PAM-4 applications
- Optimizes PCB real estate in space-constrained applications
- With a 0.60mm pitch between contacts and 2.40mm pitch between DPs, the dense connector design fits from 30DPs to 50DPs per square inch to deliver high data rates in a small footprint for networking and Top-Of-Rack (TOR) applications tuned for 100Ohms
- Enables expansion of DP sizes with minimal tooling investment
- Contact wafers are arranged in “bays” to enable simple expansion from 8DPs to 16DPs
- Delivers secure connectivity for dense installations
- An integrated “dual hasp” system offers up to 25N of retention force while an available positive lock with a pull bale increases the unlatch force to approximately 50N
- Offers robust attachment to the PCB
- Tin-plated, stainless steel solder nails are pin-in-paste processed to ensure the plug is reliably attached to the PCB
- Tin-plated, stainless steel solder nails are pin-in-paste processed to ensure the plug is reliably attached to the PCB
Applications
- Servers and storage
- TOR switches
- Core routers
- Data center switches
- Telecommunications
- Cell towers
- Remote radio units (part of 5G)
- Networking
- Ethernet applications
- Cable trays
