Laird Technologies Tflex SF7 series silicone free thermal gap fillers

Tflex SF7 is an innovative, high performing thermal material in Laird's non-silicone based formulation gap filler portfolio. The non-silicone based formulation technology provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thickness ranges from 0.5mm (0.020") to 4mm (0.160") in 0.5mm (0.020") increments available as standard.

Features

• Non-silicone based formulation
• Low peak and residual pressure
• Excellent surface wetting for low contact resistance
• Exceptionally low thermal resistance
• UL V0 flammability rating
• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH