Laird Technologies Tflex SF4 series silicone free thermal gap fillers

Tflex SF4, Tflex SF7, and Tflex SF10 are innovative, high performing thermal materials in Laird’s silicone free gap filler portfolio. The silicone free technology provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thicknesses from 0.5mm (.020”) up to 4mm (.160”) in 0.5mm (.020”) increments available as standard.

Features

• Silicone free formulation
• Low peak and residual pressure
• Excellent surface wetting for low contact resistance
• Exceptionally low thermal resistance
• UL V-0 Flammability Rating

Applications

• Datacom systems
• Automotive electronics
• Telecom systems
• Optical modules
• Cameras