KEMET KC-LINK™ KONNEKT™ high-density capacitors

KEMET continues to strengthen its power conversion solutions by extendingits popular KC-LINK range using KONNEKT high-density packaging technology to meet thegrowing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLCresonant converters, and wireless charging applications. This technology combines KC-LINK’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system withKONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layerceramic capacitor.

High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mountedwithout the use of lead frames. This design provides extremely low effective seriesinductance (ESL), increasing the operating frequency range and allowing for furtherminiaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handlingcapability further.

KEMET's KC-LINK™ with KONNEKT™ technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern. KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames. These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.

Features

• Extremely high-power density and ripple current capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Low-loss orientation option for higher current handling capability
• Capacitance offerings ranging from 44 nF to 880 nF
• DC voltage ratings from 500 V to 1,700 V
• Operating temperature range of -55°C to +150°C
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reflow profiles

Applications

• Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems
• Data centres
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubber