Amphenol Industrial RADSOK® Power to Board
Amphenol Industrial announces RADSOK® Power to Board
The Amphenol Industrial Global Operations RADSOK® solution offers options for high current single-point connections with a compact footprint design that can supply up to 120 Amps to the board. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. RADSOK® Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools.
Features
- Smaller outside diameter of RADSOK®, saving space of package
- High volume automated assembly processes
- Consistency in performance
- Improved mechanical strength
- Lower voltage drop and resistance
- Low temperature rise
