Amphenol CS Flexible Printed Circuit assembly

Amphenol’s BergStak®, MezzoStak®, Conan®, ComboStak® and PowerStak® are industry proven board-to-board solutions. To enlarge the advantages of these recognized board-to-board solutions, we have expanded our offering with Flexible Printed Circuit (FPC) assemblies, which provide design flexibility to customers.

• Flexible option for space constraint environments where PCBs are not an option
• Comprehensive range of pitch sizes, positions and stack heights to satisfy all needs
• High-speed performance up to 16Gb/s
• Utilize SMT process with higher process consistency, and lower assembly cost
• Fully customized solutions using all advantages of board-to-board connectors like mating reliability and different profile heights 

Features

• Broad offering of:
  • Pitch sizes: from 0.4mm to 2.0mm
  • Positions: from 2 to 200
  • Heights: from 1.5mm to 20mm
  • FPC lengths: from 100mm to 500mm
  • Special FPC shapes
• Comprehensive range of sizes and profile heights to satisfy all needs when board-to-board or wire-to-board connections are not an option
• High-speed signal capability of up to 16Gb/s
• Suitable for high data transmission applications
• FPC cable with SMT process
• Space, cost and weight saving and higher process consistency, compared to CTW cable assembly or PCB-to-board connections
• Flexible Printed Cable utilizing all advantages of board to board connectors
• Wide choice of mating interfaces; current rating capability; vibration resistance (USCAR spec) and locking features available

Applications

• Automotive
• Communications
• Consumer 
• T/DA
• Industrial and instrumentation
• Medical