MicroQSFP interconnect solutions

TE Connectivity (TE) introduces new microQSFP pluggable I/O single high cages and surface mount connectors. TE is the first company to bring micro Quad Small Form-Factor Pluggable (microQSFP) interconnects to market from the microQSFP Multi Source Agreement (MSA), providing a higher density solution for next generation pluggable connectivity. microQSFP provides QSFP28 functionality in a smaller, generally SFP-sized form factor while providing significantly better thermal performance to help save energy costs, improved electrical performance at 25 Gbps NRZ / 56 Gbps PAM-4 and 33% higher density than QSFP to fit more ports on a standard line card.