TE Connectivity LGA 3647 Socket & Hardware

LGA 3647 socket and hardware

TE Connectivity’s (TE) LGA 3647 socket and hardware meet the next-generation designs of Intel Corporation’s (Intel) new CPU processors for higher performance and better system scaling. LGA 3647 socket is the first to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability. As one of a limited number of suppliers offering LGA 3647, TE has both socket and hardware parts available to bring you a full solution. 

TE Connectivity LGA 3647 socket and hardware INTEL CPU Avnet Abacus

Features/Applications

Features Applications
  • Meet next-generation design with LGA 3647 sockets and hardware that meet Intel’s next-generation CPU processors 
  • Provide higher performance, better system application scaling and better value with new socket and hardware design
  • Offer better coplanarity and reliability with a two-piece design that improves issues with warpage 
  • Help improve alignment and keep fingers away from the socket contact field with fabric and non-fabric carrier hardware
  • Assist in orientation and alignment for the processor heatsink module (PHM) and the spring load force necessary for socket loading with the bolster plate hardware
  • Supply mounting points for the bolster plate with back plate hardware

 
  • Servers
  • Storage
  • Data centers
  • High-performance computing

 

Contact our product specialists

Ask an expert

Have a question? Our regional technical specialists are on hand to help.

GET IN TOUCH

Resources

Subscribe to our Newsletters

Researching technology for your next application design? We can help you get project ready. Get the latest design tools and solutions, Engineers' Insight and Focus magazine sent straight to your inbox.

SUBSCRIBE