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TE Connectivity AMPMODU Interconnect System

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AMPMODU interconnect system is a comprehensive family of modular signal interconnects for board-to-board, wire-to-board, and wire-to-wire applications from 1mm (0.039”) to 3.96mm (0.156”) centerlines that are widely used across nearly all industrial applications requiring Printed Circuit Boards (PCBs).

Miniaturization is a trend impacting industries globally. The breadth of AMPMODU components, combined with its small size make it a solid interconnect system for a wide range of applications and systems. The growing need for board miniaturization is driving demand towards fine pitch connectors. It is designed to reliably and economically meet a variety of packaging and interconnection requirements. The large variety of components and application possibilities, combined with a small, compact footprint enables space savings and high quality design. This makes the AMPMODU interconnect products suitable for applications and systems across a broad range of industries.

Scroll down to learn more about our AMPMODU Interconnect System, available in 1mm, 1.27mm, 2mm, 2.54mm and 3.96mm pitch.

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Features/Applications

Table

Features
Modular concept, utilizing precision formed receptacle contacts and mating posts that ensures interchangeable solutions for flexible design Design flexibility through a comprehensive portfolio of single and double row options for board-to-board, wire-to-board, and wire-to-wire applications with TE designed application tooling Economic and compact design allows for PCB space savings Multiple solder tail lengths available to accomodate different PCB thicknesses	Available in most mounting geometries, plating types, and packaging styles to offer flexible manufacturing options and meet cost requirements for customers Dual-beam contacts provides reliable signal transfers in high vibration environments Most connectors meet industry environmental, health, and safety requirements (RoHS, REACH, and UL) Connector housings available in high-temp resin compatible with reflow solder processes, saving customers time and money

Features

Modular concept, utilizing precision formed receptacle contacts and mating posts that ensures interchangeable solutions for flexible design
Design flexibility through a comprehensive portfolio of single and double row options for board-to-board, wire-to-board, and wire-to-wire applications with TE designed application tooling
Economic and compact design allows for PCB space savings
Multiple solder tail lengths available to accomodate different PCB thicknesses

Available in most mounting geometries, plating types, and packaging styles to offer flexible manufacturing options and meet cost requirements for customers
Dual-beam contacts provides reliable signal transfers in high vibration environments
Most connectors meet industry environmental, health, and safety requirements (RoHS, REACH, and UL)
Connector housings available in high-temp resin compatible with reflow solder processes, saving customers time and money