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TE Connectivity ICCON slim power pin and socket portfolio

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TE Connectivity’s new ICCON slim power pin and socket products can offer scalable design options and space savings for efficient installation in applications up to 35A. These new products do not require tools to install or remove the ICCON Slim products while also accommodating PIP (pin in paste) reflow processes. Scalable design options provide a variety of position options including 4pos, 6pos, 8pos. Available in an orthogonal application with soldering mounting. The compact design provides a lowprofile enabling space savings

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Features/Applications

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Features Applications
  • Scalable design options provide a variety of positions options 4pos, 6pos, 8pos; orthogonal application; soldering mounting; 35A/pin
  • Ease of installation alleviates the requirement of tools to install or remove the ICCON Slim products. They also accommodate PIP (pin in paste) reflow process
  • Space Savings - The compact design provides a low-profile enabling space savings
  • Right angle pin mates with right angle socket. For orthogonal application
  • Current capacity: up to 35A
  • Plug pin and socket can solder mount onto PCB
  • Fit for PIP process
  • Switches
  • Servers
  • Storage Devices
  • Wireless

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