TE's fine pitch board-to-board connectors are optimized interconnect solutions for smaller and thinner electronic consumer products. They are designed to meet the miniaturization trend in the market. Our product series features a smaller centerline, narrower body, and lower mating height. Plus, there are various advantages including formed contacts to provide contact points on rolled surface for high reliability, enhanced usability for easy mating and robustness, sufficient area for pick and place, Ni-barrier for solder wicking, and more. Our design capability allows us to continue to develop innovative new products in the fine pitch board-to-board connector series.

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